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KILL AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset

AiM Future requests that their press release NewsItemId: 20250812809031 issued August 28, 2025 “AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset” be killed.

The release was issued in error by AiM Future.

A replacement release will not be issued.

AiM Future will collect the necessary technical data for CPU-based lightweight AI model development and create models capable of running in high-performance MCU environments such as the STM32N6x7 series.

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